Bernstein Wafer Tweezer 12 mm Jaw With Graduated Lower Paddle No Teeth 4 DW This Week's Specials 118° web thinned point reduces

118° web thinned point reduces the amount of thrust required

Handle Type: Precision

Cut: Right Cut

13/16" 12 Point Long Pattern Combination Wrench

Product Dimensions: 37 x 220 x 37mm

Bernstein Wafer Tweezer 12 mm Jaw With Graduated Lower Paddle No Teeth 4 DW This Week's Specials 118° web thinned point reducesOverview For positioning of flat and fine components, e. g. extremely sensitive and breakable wafer (Glass wafer etc.) fine PCB's and LCD's very smooth and non reflective surface high grade steel SA, anti magnetic. Specifications Brand Bernstein Product Type Wafer Tweezer Length 130 mm Weight 17 g Special Features With graduated lower paddle, no teeth 4 DW For Wafer Size 3 in Jaw Size 12 mm Resources Product Brochure